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Shear strength development of the phenol–formaldehyde adhesive bond during cure
Matej Jost, Milan Sernek
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Oznake: phenol-formaldehyde;PF;adhesive;cure;curing;shear strength;dielectric analysis;DEA;automated bonding evaluation system;ABES
The development of the shear strength of the phenol-formaldehyde (PF) adhesive bond during curing was investigated. Five different PF adhesive mixtures and 1.1 mm thick peeled beech (Fagus sylvatica L.) veneer were used to produce lap-shear specimens, which were cured at a pressing temperature of 16 ...
Leto: 2008 Vir: Repozitorij Sci Vie
Št. zadetkov: 1
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